Innovator in specialized semiconductor soldering equipment
Built on over 30 years of vacuum soldering and thermal processing expertise from our German headquarters, we strengthen our foundation with the credibility of state-owned capital.
About Us
Professional R&D Team
Full-scale adoption of Germany's 30-year core technology for vacuum soldering, with German engineers stationed in China providing on-site technical support.
About Us
Precision Manufacturing, Quality Assured
German quality, local delivery, industry-leading performance.
About Us
Trusted Partner
Building long-term partnerships with leading global enterprises to create a brighter future together.
About UsTechnical Expertise
Authentic German engineering and craftsmanship. Soldering quality matches the original standard. Temperature control and void rate benchmarks European imported equipment.
Production Capacity
Equipped with German-imported high-precision machining centers for micron-level accuracy, our manufacturing processes meet top international standards.
Supply Assurance
German quality, locally produced with local after-sales support and ready-to-ship spare parts—lower costs and ultra-fast delivery.
Customer Service
Build a full-lifecycle service system spanning pre-sales consulting, in-sales guidance, and post-sales maintenance. Conduct regular inspections and servicing to ensure efficient equipment operation throughout its entire lifecycle.
Product Center
Providing specialized semiconductor equipment to meet diverse customer needs
Vacuum Soldering System VS 160 CN
Vacuum Soldering System VS 320 CN
Vacuum Soldering System VS 320 i CN
Vacuum Soldering System VS XL CN
Technical Process
The focus is on the manufacture of vacuum soldering and sintering (pressureless) equipment. Using high-precision automated systems and highly qualified technical staff, we manufacture and deliver extremely reliable equipment and systems.
Vacuum soldering
Vacuum soldering with budatec systems is a specialized type of soft soldering for temperatures up to 450°C. Heat transfer occurs through a combination of conduction, radiation, and convection. The process is designed for applications that require, void-free solder joints. Three-dimensional defects such as voids and porosity can occur when flux and solvents escape from the joint but cannot fully leave the solder composite.The budatec soldering process addresses this with an extended process step: vacuum. The purpose of vacuum soldering is to enhance final joint quality and improve standard reflow soldering performance. By applying vacuum, process residues can escape during the preheat and solder liquid phases, thereby reducing or eliminating defects in the solder composite.
Learn moreSintering (pressureless)
Sintering (pressureless) is an advanced joining process that creates strong, dense bonds between components by controlling temperature, pressure, and time at low temperatures using micron-sized sintering particles. After solvent treatment, these particles form a paste and are applied to substrates—such as organic PCBs, inorganic substrates, or lead frames—using methods similar to reflow soldering (e.g., screen printing or dispensing). This approach also supports the assembly of pre-soldered components. With pressureless sintering technology, composite materials can be directly integrated between bare dies and/or passive components. Sintering is primarily used in power module manufacturing but is also widely adopted in lighting systems, automotive engineering, wind turbine production, and industrial drive technologies.
Learn moreApplication Center
At our Application Center, we collaborate with partners using a wide range of technologies. This enables us to develop or implement customer applications ranging from simple vacuum soldering to complete module assembly. We also handle small-batch and pre-production runs for pressureless sintered and/or soldered modules.
Learn moreAbout budatec
budatec (Shandong) Intelligent Electronic Co., Ltd. is a high-tech enterprise specializing in the R&D of semiconductor vacuum soldering systems and intelligent manufacturing, located in the China-Europe Industrial Park in Yanzhou District, Jining City. As the first Joint venture of the German budatec GmbH project in China, the company has deep expertise in vacuum soldering and semiconductor packaging equipment, establishing itself as a leading technology-driven "hidden champion" in the industry. In 2025 3, the budatec smart manufacturing project was officially signed and launched in Yanzhou. Smart manufacturing support facilities are being rapidly built, with full production capacity expected by year-end to enable localized series production of core technologies.
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Professional Team
Gathering industry leaders to provide clients with comprehensive professional services
R&D Team
Focused on product R&D and technological innovation, with multiple core patents.
Production Team
Lean production management to ensure product quality and delivery efficiency
Technical Support Team
Timely professional service with rapid response to customer needs
Sales Team
Deepen understanding of customer needs and deliver professional solutions