About budatec

German hidden champion, now with a domestic replacement base in Shandong

budatec (Shandong) Intelligent Electronic Co., Ltd. is a joint venture between Germany's budatec GmbH— the undisputed leader in vacuum brazing technology—and Jining State Capital Platform. As the sole Asia-Pacific manufacturing base of budatec GmbH, it was a key foreign-investment project signed at the Cross-Border Qingdao Summit for two consecutive years (2024, 2025). The equity structure features control by Jining local industrial funds and shares held by the German original equipment manufacturer's technical team. The company has fully transferred Germany's 30-year core expertise in vacuum soldering, with German engineers stationed locally to provide ongoing technical support.

Leveraging over 30 years of vacuum soldering and thermal process expertise from our German headquarters, we combine state-owned capital credibility with deep integration into the global semiconductor supply chain. We specialize in the R&D, manufacturing, and delivery of high-reliability semiconductor vacuum soldering equipment, filling the domestic gap for high-end vacuum soldering imports. We provide our customers with end-to-end vacuum soldering solutions—from lab-scale development to industrial mass production.

Core products include vacuum soldering systems (manually loaded batch systems, automated inline systems) and vacuum sintering equipment (pressureless).

budatec (Shandong), based in Shandong and serving nationwide, leverages German quality, local delivery, and rapid response to drive the industrial upgrade of semiconductors and electronics manufacturing. We are committed to becoming a technology benchmark and trusted partner in vacuum soldering and advanced thermal processing equipment.

1 Complete German factory technology, authentic German craftsmanship, identical soldering quality, and temperature control/void rate benchmarked against European imported equipment.

2 Provincial key foreign-funded semiconductor project with strong state-owned capital backing, the best solution for localization.

3 Localized manufacturing and after-sales support, in-stock spare parts, cost reduction + rapid delivery.

4 German-standard quality control ensures a machine lifespan of 10+ years, low failure rates, and significantly reduced production line downtime maintenance costs.

5 Vacuum rapid evacuation chamber with formic acid N₂/H₂ mixed hydrogen atmosphere reduction atmosphere; solder joint void rate consistently ≤ 1%, achieving < 0.5% for high-end SiC modules. Oxygen-free reduction environment eliminates the need for flux.

6 Max. heating/cooling rate of 3K/s (180K/min) to reduce cycle time per batch and boost productivity.

7 Global temperature control accuracy ±1.5°C with uniform heating plate field.

8 Max processing temperature 450°C. Supports low-temperature SMT, eutectic soldering, and silver sintering (pressureless) processes to meet the full thermal range requirements for silicon IGBTs, silicon carbide (SiC), and MCU chips.

9 Standard nitrogen protection; optional: formic acid (HCOOH) cleaning, N₂/H₂ mixed hydrogen atmosphere.

10 German-developed MCU controller with visual process curves; access thousands of soldering programs instantly. Switch between IGBT, SiC, QFN, and BGA processes in seconds. Full-process data visibility with real-time recording, local + cloud storage to meet our customers traceability requirements. Built-in smart alerts for over-temperature, gas leaks, low gas levels, and vacuum pump faults to reduce scrap rates.

Third-Generation Semiconductors | New Energy Vehicles

Perfectly suited for manufacturing of SiC power modules, onboard inverters, and OBC substrates in charging piles, meeting high heat dissipation requirements across wide temperature ranges.

Optical Communication & Optoelectronics Industry

Flux-free vacuum soldering for TOSA/ROSA optical components, industrial lasers, and LiDAR chips to eliminate optical path contamination.

Aerospace & Space Electronics

Aerospace-grade hermetic packaging for phased array radar, satellite-onboard chips, and UAV flight control components—designed to withstand extreme space temperature cycles and radiation.

Advanced Semiconductor Micro-Assembly & AI Chips

3D stacked chips, MEMS sensors, RF chips, wafer-level eutectic bonding, and thermal solutions tailored for AI computing chip cooling requirements.

Medical \ MEMS Precision Sensing

Low-impurity clean soldering for CT image detectors, implantable medical chips (e.g., brain-computer interfaces), and gyroscope sensors.

Photovoltaic, Specialized Electronics

Photovoltaic inverter power chips, thin-film solar cell chips, high-power power modules, servo drive power devices

General Core Process Types

Research equipment, chip-to-heatsink/ceramic substrate soldering, metal can hermetic sealing soldering, formic acid activation for oxide layer removal.