Technical Processes

Focus on precision manufacturing and vacuum processes to deliver highly reliable complete equipment systems.

Vacuum soldering

Vacuum soldering with budatec systems is a specialized type of soft soldering for temperatures up to 450°C. Heat transfer occurs through a combination of conduction, radiation, and convection. The process is designed for applications that require, void-free solder joints. Three-dimensional defects such as voids and porosity can occur when flux and solvents escape from the joint but cannot fully leave the solder composite.The budatec soldering process addresses this with an extended process step: vacuum. The purpose of vacuum soldering is to enhance final joint quality and improve standard reflow soldering performance. By applying vacuum, process residues can escape during the preheat and solder liquid phases, thereby reducing or eliminating defects in the solder composite.

Sintering (pressureless)

Sintering (pressureless) is an advanced joining process that creates strong, dense bonds between components by controlling temperature, pressure, and time at low temperatures using micron-sized sintering particles. After solvent treatment, these particles form a paste and are applied to substrates—such as organic PCBs, inorganic substrates, or lead frames—using methods similar to reflow soldering (e.g., screen printing or dispensing). This approach also supports the assembly of pre-soldered components. With pressureless sintering technology, composite materials can be directly integrated between bare dies and/or passive components. Sintering is primarily used in power module manufacturing but is also widely adopted in lighting systems, automotive engineering, wind turbine production, and industrial drive technologies.

Application Center

At our Application Center, we collaborate with partners using a wide range of technologies. This enables us to develop or implement customer applications ranging from simple vacuum soldering to complete module assembly. We also handle small-batch and pre-production runs for pressureless sintered and/or soldered modules.