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Vacuum Soldering System VS 160 CN

The VS 160 vacuum soldering system has a heating plate size of 160 mm x 160 mm and offers highest performance with a small footprint due to its high heating and cooling rates in the range of 200 K/min. The VS 160 can be used for research and development as well as for the production of smaller batches under production conditions. The system is available in 2 variants. As a VS 160 S (benchtop) and as a VS 160 UG (with a base frame). This makes it possible to integrate additional options such as a vacuum pump or HCOOH gas line.

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Vacuum Soldering System VS 320 CN

With heatingplate dimensions of 320 mm × 320 mm and excellent performance, the VS 320 vacuum soldering system is an ideal choice for medium to large-scale production. VS 320 offers a range of options, including N₂/H₂ mixed hydrogen atmosphere , HCOOH, specialized gases, and integration with our sintering press. This versatility also makes it a frequent choice in R&D applications.

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Vacuum Soldering System VS 320 i CN

Flexible integrated vacuum soldering system with autonomous loading/unloading of product carriers, based on VS 320 and all available options.

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Vacuum Soldering System VS XL CN

With a heating plate measuring 1000 mm × 320 mm, the VS XL vacuum soldering system is designed for processing large components and high-volume batches. In addition to optional configurations, N₂/H₂ mixed hydrogen atmosphere, HCOOH, specialty gases, and motor-driven robotic arms can be integrated within the work zone.

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