Smart Kunshan, Connecting Two Shores | budatec Showcases at the 2026 Cross-Strait AI Industry Development Conference, Uniting the Intelligent Connected Vehicle and Semiconductor Supply Chain
The 2026 Cross-Strait (Kunshan) Artificial Intelligence Industry Development Conference and Intelligent Connected Vehicle Supply-Demand Matching Event was successfully held in Kunshan, Jiangsu, on 2026-8-16. The conference brought together over 450 industry experts, research institutions, leading enterprises, and supply chain partners from both sides of the Taiwan Strait to create a high-end platform for cross-strait AI innovation collaboration and precise matching of intelligent connected vehicle supply and demand. This initiative aims to foster new quality productive forces and drive high-quality industrial development. budatec (Shandong) Intelligent Electronics Co., Ltd. attended the event, engaging with cross-strait industry partners to explore growth opportunities and discuss project collaborations.
Hosted by the Cross-Strait Enterprise Summit, the event officially launched the Cross-Strait AI Industry Alliance and unveiled a 30 billion yuan Cross-Strait AI Industry Development Fund. The fund will prioritize cutting-edge sectors including AI servers, embodied AI, and intelligent connected vehicles, advancing cross-strait collaboration from supply chain support to joint R&D in innovation chains. Concurrently, a supply-demand matching forum for the intelligent connected vehicle industry was held through keynote speeches, project pitch sessions,achievement exhibitions, and one-on-one business talks, connecting upstream and downstream segments such as complete vehicle manufacturing, automotive electronics, power semiconductors, and precision equipment to significantly improve resource allocation efficiency across the industrial chain.
At the main forum, academicians, experts, and representatives from leading industry companies conducted in-depth analysis of current industry trends and future development directions on hot topics such as AI scenario implementation, vehicle-road collaboration, reliability of automotive power devices, and domestic localization of high-end semiconductor manufacturing equipment. The budatec team seized this opportunity to engage in multiple rounds of exchanges with automotive electronics manufacturers and semiconductor packaging enterprises in the Yangtze River Delta region. They showcased the company's vacuum soldering systems , comprehensive high-reliability packaging solutions for automotive power devices and AI computing hardware components. The team also provided detailed information about the Shandong production base, highlighting Germany's advanced technology and quality control standards alongside local delivery advantages. Multiple preliminary cooperation agreements were reached on-site.
Representatives from budatec (Shandong) Intelligent Electronic Co., Ltd. stated: "The rapid expansion of smart connected vehicles and AI computing hardware industries is raising the bar for the packaging reliability of power semiconductors and automotive electronic components. Vacuum soldering processes are critical to ensuring long-term device stability. Kunshan boasts a mature Taiwanese industrial cluster and a well-developed automotive electronics supply chain. This conference participation serves as a key channel for budatec to access high-quality resources in the Yangtze River Delta, while also allowing us to leverage our technical expertise in vacuum soldering equipment to contribute to the automotive semiconductor supply chain."
budatec (Shandong) Intelligent Electronic Co., Ltd. is located in Yanzhou District, Jining City. As budatec Germany's domestic R&D and manufacturing base for specialized semiconductor equipment, our core products—vacuum soldering systems—are widely used in power semiconductors, automotive electronics, optical communication/optoelectronic devices, AI chips, specialty electronics, and medical/MEMS precision sensing applications. We are dedicated to solving critical challenges in high-reliability packaging processes for advanced electronic components and breaking through supply chain bottlenecks in equipment.
Next, the company will fully leverage the latest industry insights and market intelligence from this conference to intensify R&D investment in core equipment, continuously optimize product performance, and enhance domestic supply capabilities. Leveraging the networking platform established at the conference, we will deepen collaboration with upstream and downstream partners across the vehicle-mounted semiconductor supply chain, actively expand our presence in the Yangtze River Delta region, drive industry-academia-research collaborative innovation, and accelerate the growth of the semiconductor packaging equipment sector.